CAPABILITIES

Basic Materials

We handle different types of basic materials:

  • FR4
    • (DE104 / DE104KF / IS400 / PCL370HR)
    • (R-1755-C / R-1755-M / R-1755-V) (IT140 / IT158 / IT180)
    • (VT47 / VT481)
  • HIGH SPEED MATERIAL
    • (FR408HR / I-TERA)
  • HIGH SPEED-HALOGEN FREE
    • (R-1566-W)
  • HIGH TG-HALOGEN FREE
    • (EM-370 / EM-37B)
  • TEC-THERMAL IMS SERIES
    • (Aluminium Base Layer / CeramicFilled / Non-reinforced Dielectric )
  • ROGER SERIES
    • (High Frequency: PTFE-CU-Clad / PTFE Di-Clad / RO3000 / RO4000 /
    • RT-Duroid / TMM / AS Series / Bondply-Prepreg )

Types of PCBs

Eleprint handles various types of technologies, offering a wide range of products:

  • Single-sided, double-sided, multi-layer with / without blind and underground holes, metal core, sequential build-up.
  • Flexible / Rigid-flexible: Single face / double face / multilayer with or without stiffeners.

The main features of Eleprint printed circuit boards are:

  • Maximum number of layers: 28
  • Maximum PCB size: 558*660
  • Basic copper: 9-140 um (inner)
  • Basic copper: 9-240 um (outer)
  • Minimum inner layer thickness: 50 um
  • Maximum PCB thickness: 6 mm
  • Impedance control and measurement
  • Boarding: 0.5%

Thanks to modern, automated precision equipment, many requirements can be met:

  • Minimum width / insulation (inner) um (mil): 75/75 (3/3)
  • Minimum width / insulation (outer) um (mil): 75/75 (3/3)
  • Minimum mechanical hole size mm: 0.2
  • Max Aspect Ratio: 12:1
  • Minimum soldermask opening: 50 um

In addition, Eleprint provides support for the following specifications:

  • Blind Vias
  • Copper reduction
  • Hard Gold
  • Plug hole
  • Micro vias
  • Heatsink paste
  • CU Inlay
  • Sink pads