Elemaster Group continues to strengthen its technological capabilities with the introduction of an advanced laser jet balling system, a cutting-edge solution enabling the precise deposition and controlled fusion of alloy spheres through laser technology.
This innovative process ensures outstanding accuracy and supports a wide range of applications across microelectronics and advanced packaging, including BGA, PCB and cLCC balling, BGA rework and repair, wafer bumping, MEMS packaging, optoelectronics, high-frequency devices, and TSV-VIA solder filling.
The technology is particularly strategic for BGA re-balling, allowing the replacement of lead-free spheres with Tin–Lead alloy spheres, which remain essential for high-reliability sectors such as avionics and aerospace. In addition, the capability to selectively replace individual spheres enables targeted interventions on components with localised defects, enhancing reliability and extending product lifecycle.
This investment further reinforces Elemaster’s position in most demanding segments of advanced electronics, confirming the company’s continued commitment to innovation, process excellence and support of mission-critical applications.