Why metallographic analysis matters
In today’s high-tech industries, every electronic product must meet exceptionally high standards of reliability and safety. This is especially true in sectors such as Railways, Medical & Healthcare, Avionics & Aerospace, where even the smallest hidden defect can have severe consequences. For these industries, quality control is not just a final check but an integrated process that starts with design and extends throughout the entire product lifecycle.
Metallographic analysis plays a fundamental role in this process. By exploring the microscopic structure of metals, solder joints and printed circuit boards (PCBs), it provides a unique lens through which engineers verify the intrinsic quality of each component and process.
What is metallography?
Metallography is the scientific discipline that studies the internal microstructure of metals and alloys. In the electronics field, it is applied to examine solder joints, copper layers, coating thicknesses and bonding areas, identifying imperfections that standard inspections cannot reveal.
At Eletech, the lead company of the International Design Centres (IDCs) , R&D division of Elemaster Group, metallographic analyses are daily practice to ensure that every detail complies with specifications. This precision is essential for applications where failure is not an option.
Inside the joint: how it works
A typical metallographic analysis involves taking cross-sectional samples of solder joints or PCBs. These samples are then polished to highlight the grain structure, intermetallic layers and any voids, cracks or delaminations that could affect reliability.
- Formation of intermetallics: at the solder-to-pad interface, proper formation is vital; excessive or uneven layers weaken mechanical strength.
- Detection of voids and micro-cracks: voids can cause thermal hotspots; micro-cracks can propagate under stress.
- Plating integrity: checking the uniformity and thickness of metallic coatings is crucial for corrosion resistance and electrical performance.
Beyond inspection: a tool for process validation
Metallographic analysis is more than an inspection method, it is a proactive tool for process validation and continuous improvement. Insights from the lab feed directly into production lines, optimising soldering techniques, material choices and assembly processes.
This approach supports Design for Manufacturability (DFM), Design for Assembly (DFA) and Design for Testing (DFT), contributing to robust, repeatable and scalable industrialisation.
Supporting Failure Analysis
When failures occur in the field, metallographic analysis becomes an invaluable diagnostic instrument. By revealing where and why a connection failed, engineers can pinpoint the root cause, whether due to thermal stress, mechanical fatigue, material inconsistencies or manufacturing defects.
These findings strengthen future designs and prevent costly recurrences. For this reason, metallography is an integral part of Eletech’s Failure Analysis methodology.
Accredited competence and advanced equipment
Eletech’s laboratory is ISO/IEC 17025:2017 accredited, guaranteeing that its methods and results meet the highest international standards. Specialist teams use high-resolution microscopes, precision cutting and polishing tools, and advanced software for structural analysis.
This rigorous environment ensures that every result provides reliable data for quality control, pilot production validation or complex failure investigation.
Serving high-reliability industries
For Medical & Healthcare, metallography helps ensure patient safety by validating devices that must work flawlessly over time. In Railways, it secures systems exposed to vibrations, temperature swings and decades of service. In Avionics & Aerospace, where hardware must perform under extreme conditions, it confirms that every solder joint and PCB meets strict reliability requirements.
A bridge from research to production
What makes Eletech’s approach unique is its integration within Elemaster Group’s ecosystem. Findings are shared throughout the value chain, from design to industrialisation and after-sales support.
This ensures that lessons learned at the microscopic level translate into macroscopic benefits: improved product reliability, faster Time-to-Market, and full compliance with industry standards.
The invisible guarantee
Ultimately, metallographic analyses represent the invisible guarantee that every product leaving Elemaster’s facilities is built on solid foundations. They turn each inspection into an opportunity for improvement, each detail into a promise of technological excellence, and each component into a statement of trust for the industries of tomorrow.