Today, Elemaster is attending the IMAPS Italy Workshop: “High Reliability Packaging for Avionics, Aerospace & Defense” at Politecnico di Milano – Bovisa Campus.
In mission-critical sectors such as Avionics, Aerospace and Defense, failure is simply not an option. Electronic systems must operate reliably even in the most demanding environments, withstanding thermal cycles, vibrations and other challenging operating conditions. This is why High-Reliability electronic packaging and assembly play a fundamental role in ensuring safety, performance and long-term reliability.
The workshop brings together technical expertise and industry perspectives around the challenges involved in designing, packaging, assembling and testing electronic components and systems for applications where performance, precision and long-term reliability are essential.
As a partner supporting highly demanding electronic applications, Elemaster continues to strengthen its advanced manufacturing capabilities. A recent example is the introduction of the Laser Jet Balling System, the first laser reballing system installed in an Italian EMS, further expanding the Group’s expertise in microelectronics and advanced packaging.
The technology offers important advantages for High-Reliability applications:
- Reduced thermal stress: localised laser heating helps protect sensitive components from the thermal impact associated with traditional reflow processes.
- Micrometric precision: automated and highly accurate solder ball placement supports complex BGA and advanced packages.
- Alloy conversion and lifecycle support: the system enables the replacement of lead-free spheres with Tin–Lead alloy spheres for specific high-reliability requirements, particularly in avionics and aerospace applications.
Events such as the IMAPS Italy Workshop represent an important opportunity to exchange technical knowledge, explore the evolution of High-Reliability electronics and contribute to strengthening expertise across the European electronics value chain.